Applied Materials, Inc. unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements. Advanced chips are built one layer at a time, and each of billions of individual features must be perfectly patterned and aligned to create working transistors and interconnects with optimal electrical characteristics. As the industry increasingly moves from simple 2D designs to more aggressive multi-patterni...